Gold Sputtering
Gold Sputtering
1.Open the Ar valve of the Ar cylinder is open.
2. Lift up the sputter arm.
3. Insert the specimen into the chamber
Such as an SEM sample stage or a glass side
4. Put down the sputter arm.
5. Switch on the main switch (Green button).
The vacuum pumps start pumping down.
6. Wait until the vacuum reaches ~ 5E-2 mbar (white marking line).
7. Press the"Flush" button, the vacuum rises and reaches ~ 5E-2 mbar again.
Press the "Flush" button again (this process can be repeated).
This is to flush off the remaining oxygen in the chamber to avoid oxidation during sputtering.
8. Set the timing.
You can approximate the time required for a given Au thickness under a selected current (15, 30, 60 mA).
By default, the stage of Au sputter is set to have a working distance 50 mm.
9. Press "Sputtering Start" and adjust the Current.
You can only adjust the current when the sputtering is started.
You are advised to do it quickly.
10. The time counts down.
The sputter will be stopped automatically when the selected time has elapsed.
11. Turn off the main switch (Green Button) and wait for the chamber to reach atmospheric pressure.
12. Lift up the sputter arm and take out the specimen.
13. Close the Argon valve of the Ar cylinder.
Examples: Silicon Nitrite TEM grid is sputtered with gold to improve the electrical conductivity. This reduces the charging effect during HIM pattering and retains good drilling resolution.